Capability sheet - intechcircuit

Technology Capabilities
Layer	1~30L
Min.inner Layer Trace	0.076mm
min.inner layer Space	0.076mm
Min.outer Layer Trace	0.076mm
Min.outer Layer Trace	0.076mm
Max.inner layer copper Thickness	6oz
Max.outer layer copper Thickness	14oz
Layer to Layer registration tolerance <10L	+/-0.076mm
Layer to Layer registration tolerance >10L	+/-0.125mm
Max.Finished board thickness	8mm
Min.Finished board thickness	0.3mm
Min.Core Dielectric thickness	0.051mm
Min.Impedance-Differential	+/-5%
HDI Stack up	1+N+1,2+N+2,3+N+3
Controlled Depth Drilling Tolerance	+/-0.1mm
Advanced	Buried cpacitor,buried Resistor,Embedded coin,rigid -flex,Rigid- Flex+HDI,Rigid-flex+Metal Base
Max Production Panel Size	24.5"*43"
Via in PAD	YES
BGA Pitch(with trace)	0.4mm
Soldermask Registration	+/-0.03mm
Min.Solder Dam	0.064mm
Min.Drilled Hole size-Mechanical	0.2mm
Min.Drilled Hole size-Laser	0.1mm
Max.Laser Drill Aspect Ratio	20:01
Press Fit Hole	+/-0.05mm
Layer To layer Registration Tolerance	0.04mm
Min.Dielectric Thickness	0.04mm
Controlled Depth Drilling	YES
BGA Pitch(with trace)	0.5mm
surface Finishing	ENIG,OSP,Immersion tin,immersion silver,HASL,Electrolytic gold,
Material	Normal TG,Middle Tg,High Tg,Halogen free,Low Dk Laminate, High Frequency Laminate,PI Laminate,BT Laminate